Labels for Safety, Visual and Facility ID Desktop Printers
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Overview
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Low-Profile Polyimide (B-729) withstands wave solder environments and multiple harsh washes for printed circuit board and electronic component preprocess labeling.
- High temperature low profile is ideal for processes requiring thin or lighter weight materials
- ultra-durable matte white polyimide material is thermal transfer printable
- UL Approved; Meets requirements of MIL-STD-202G, Method 215K
- Service temperature of -94 to 212° F (-70 to 100° C)
- A ribbon is required to print this material. The recommended ribbon will show here once a part is chosen
Specifications
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