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NonReflow High Temperature 2 mil Polyimide Circuit Board Labels for B33 Printers
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Overview

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Keep your printed circuit board and electronic component pre-process identification running smoothly with B-777 polyimide labels.

  • This material does not require reflow or preheating to ensure printing readability, making it ideal for boards that go through multiple harsh-condition washes
  • Use in combination with B30-R6300 ribbon to meet MIL-STD-202G, Method 215K Resistance to Solvents test requirements
  • Use of B30-R6000 ribbon is acceptable but B30-R6300 is recommended for best performance in washdown cycles – user should test to their intended application

Specifications

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